The effect of CeO2 abrasive size on dishing and step height reduction of silicon oxide film in STI–CMP - ScienceDirect
Dishing and erosion in STI CMP | Semantic Scholar
Effects of STI-fill thickness on the CMP process defects - ScienceDirect
JLPEA | Free Full-Text | Coverage Layout Design Rules and Insertion Utilities for CMP-Related Processes
Removal rate vs . step height model for reverse tone etchback STI CMP. | Download Scientific Diagram
Shallow Trench Isolation - an overview | ScienceDirect Topics
Determination of process margin and global planarization characteristics in the direct STI-CMP process
JLPEA | Free Full-Text | Coverage Layout Design Rules and Insertion Utilities for CMP-Related Processes
STI CMP stop in Silicon Nitride controlled by FullVision™ endpoint
Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms
CMP Slurry ｜ Products ｜ AGC
In-situ end point detection of the STI-CMP process using a high selectivity slurry - ScienceDirect
Consumables for Advanced Shallow Trench Isolation (STI)
Fill for Shallow Trench Isolation CMP - ppt video online download
Impact of wafer transfer process on STI CMP scratches | Semantic Scholar
Figure 1 from Research and solution of STI CMP dishing and uniformity improve for 28LP | Semantic Scholar
A schematic representation of the STI Process. Note that the... | Download Scientific Diagram
![보고서]반도체 STI CMP용 Ceria 입자 개발 및 특성 평가](https://nrms.kisti.re.kr/bitextimages/TRKO201400028228/TRKO201400028228_13_image_5.jpg "보고서]반도체 STI CMP용 Ceria 입자 개발 및 특성 평가")